Genuine CHIMEI POLYLAC ABS PA-756 original 25kg packaging & material.
CHIMEI POLYLAC ABS PA-756
High-flow general purpose ABS tuned for thin-wall and long-flow molding.
- High melt flow
- Thin-wall capable
- High gloss
- Fast cycle
Product Summary & Applications
Key characteristics
- High melt flow
- Thin-wall capable
- High gloss
- Fast cycle
Typical applications
- Thin-wall appliance parts
- Complex housings
- Long-flow components
- Caps and closures
Application insight
PA-756 fills thin-wall appliance and electronics housings where PA-757 cannot fully fill long, narrow flow paths. Higher MFR shortens cycle time on multi-cavity tools.
Cross-tags
Manufacturing & Quality Control
Injection-molding production line processing CHIMEI POLYLAC ABS resin.
Consistent supply, batch after batch
CHIMEI POLYLAC ABS PA-756 is supplied in the original 25kg moisture-proof packaging, stored in palletized warehouse stock and loaded into export containers for worldwide delivery. Lot numbers on every bag give full traceability from resin lot to your loading list.
Quality assurance
Each incoming lot is checked against the official TDS - melt flow, color and mechanical retention samples are kept for every shipment, and COA / MSDS / UL 94 documentation ships with the goods on request.
Technical Data Sheet - PA-756
Typical properties of CHIMEI POLYLAC ABS PA-756. Values marked 【待核实】 are family-typical estimates and must be confirmed against the official CHIMEI TDS.
| Property | Value |
|---|---|
| Melt Flow Rate | 35 g/10min |
| Density | 1.05 g/cm³ |
| Tensile Strength | 45 MPa |
| Izod Impact | 18 kJ/m² |
| Heat Deflection Temp | 92 °C |
| Flammability | HB - |
Test conditions: MFR at 220°C/10kg; properties per relevant ISO/ASTM methods. Always validate on your tool.
Processing Guidelines
Recommended injection-molding window for CHIMEI ABS PA-756.
- Drying temperature80 - 85 °C
- Drying time2 - 4 h
- Residual moisture< 0.05%
- Cylinder temperature200 - 240 °C
- Mold temperature50 - 80 °C
- Back pressure50 - 100 MPa
- Screw speed40 - 80 rpm
ABS is hygroscopic - pre-dry before processing to avoid silver streaks. All values are typical; confirm against the official TDS.
Mold tooling set up for PA-756 trial runs.
Download Center
Technical and compliance documents for CHIMEI ABS PA-756 are available on request.
- CHIMEI ABS PA-756 Technical Data Sheet (TDS) - request via contact page »
- CHIMEI ABS PA-756 Safety Data Sheet (MSDS/SDS) - request via contact page »
- CHIMEI ABS PA-756 RoHS Compliance - request via contact page »
- CHIMEI ABS PA-756 REACH SVHC - request via contact page »
- CHIMEI ABS PA-756 UL 94 Yellow Card - request via contact page »
- CHIMEI ABS PA-756 Certificate of Analysis (COA) - request via contact page »
All documents are provided free of charge - contact us with your company name and required grade, and we will send the PDFs by email or WhatsApp.
Selection & Differentiation
When to choose PA-756
Choose PA-756 over PA-757 only when flow length or wall thickness demands it; you trade a little surface rigidity for fillability.
Selection advice
PA-756 vs PA-757: PA-756 for thin/long-flow; PA-757 for standard rigid glossy parts.
Related CHIMEI ABS grades
Compare PA-756
Frequently asked questions
What is CHIMEI ABS PA-756 used for?
PA-756 fills thin-wall appliance and electronics housings where PA-757 cannot fully fill long, narrow flow paths. Higher MFR shortens cycle time on multi-cavity tools.
When should I choose PA-756 over similar grades?
Choose PA-756 over PA-757 only when flow length or wall thickness demands it; you trade a little surface rigidity for fillability.
What are the processing conditions for PA-756?
80 - 85 °C drying, 200 - 240 °C cylinder, 50 - 80 °C mold. See the Processing Guidelines section above.
Can I get TDS / MSDS / UL for PA-756?
Yes - request TDS, MSDS, RoHS, REACH and UL 94 documents for PA-756 via the contact page or WhatsApp, and we will send the PDFs directly.