Genuine CHIMEI POLYLAC ABS PA-756S original 25kg packaging & material.
CHIMEI POLYLAC ABS PA-756S
High-flow, easy-release general purpose ABS for demolding-challenging tools.
- High flow
- Easy release
- High gloss
- Low defect rate
Product Summary & Applications
Key characteristics
- High flow
- Easy release
- High gloss
- Low defect rate
Typical applications
- Deep-draw housings
- Textured surfaces
- Multi-cavity tools
- Thin-wall parts
Application insight
PA-756S adds release performance to the PA-756 flow profile, reducing sticking and splay on textured or deep-draw molds that standard GP grades struggle with.
Cross-tags
Manufacturing & Quality Control
Injection-molding production line processing CHIMEI POLYLAC ABS resin.
Consistent supply, batch after batch
CHIMEI POLYLAC ABS PA-756S is supplied in the original 25kg moisture-proof packaging, stored in palletized warehouse stock and loaded into export containers for worldwide delivery. Lot numbers on every bag give full traceability from resin lot to your loading list.
Quality assurance
Each incoming lot is checked against the official TDS - melt flow, color and mechanical retention samples are kept for every shipment, and COA / MSDS / UL 94 documentation ships with the goods on request.
Technical Data Sheet - PA-756S
Typical properties of CHIMEI POLYLAC ABS PA-756S. Values marked 【待核实】 are family-typical estimates and must be confirmed against the official CHIMEI TDS.
| Property | Value |
|---|---|
| Melt Flow Rate | 35 g/10min |
| Density | 1.05 g/cm³ |
| Tensile Strength | 45 MPa |
| Izod Impact | 18 kJ/m² |
| Heat Deflection Temp | 92 °C |
| Flammability | HB - |
Test conditions: MFR at 220°C/10kg; properties per relevant ISO/ASTM methods. Always validate on your tool.
Processing Guidelines
Recommended injection-molding window for CHIMEI ABS PA-756S.
- Drying temperature80 - 85 °C
- Drying time2 - 4 h
- Residual moisture< 0.05%
- Cylinder temperature200 - 240 °C
- Mold temperature50 - 80 °C
- Back pressure50 - 100 MPa
- Screw speed40 - 80 rpm
ABS is hygroscopic - pre-dry before processing to avoid silver streaks. All values are typical; confirm against the official TDS.
Mold tooling set up for PA-756S trial runs.
Download Center
Technical and compliance documents for CHIMEI ABS PA-756S are available on request.
- CHIMEI ABS PA-756S Technical Data Sheet (TDS) - request via contact page »
- CHIMEI ABS PA-756S Safety Data Sheet (MSDS/SDS) - request via contact page »
- CHIMEI ABS PA-756S RoHS Compliance - request via contact page »
- CHIMEI ABS PA-756S REACH SVHC - request via contact page »
- CHIMEI ABS PA-756S UL 94 Yellow Card - request via contact page »
- CHIMEI ABS PA-756S Certificate of Analysis (COA) - request via contact page »
All documents are provided free of charge - contact us with your company name and required grade, and we will send the PDFs by email or WhatsApp.
Selection & Differentiation
When to choose PA-756S
Between PA-756 and PA-756S, choose the 'S' when ejection marks or sticking appear; otherwise PA-756 is sufficient.
Selection advice
PA-756S vs PA-756: same flow class, better release; pick 'S' for sticky/textured tools.
Related CHIMEI ABS grades
Compare PA-756S
Frequently asked questions
What is CHIMEI ABS PA-756S used for?
PA-756S adds release performance to the PA-756 flow profile, reducing sticking and splay on textured or deep-draw molds that standard GP grades struggle with.
When should I choose PA-756S over similar grades?
Between PA-756 and PA-756S, choose the 'S' when ejection marks or sticking appear; otherwise PA-756 is sufficient.
What are the processing conditions for PA-756S?
80 - 85 °C drying, 200 - 240 °C cylinder, 50 - 80 °C mold. See the Processing Guidelines section above.
Can I get TDS / MSDS / UL for PA-756S?
Yes - request TDS, MSDS, RoHS, REACH and UL 94 documents for PA-756S via the contact page or WhatsApp, and we will send the PDFs directly.